Ultra-thin material processing tool: the application of capacitor film slitting machine in the field of precision electronic film

As the core equipment for ultra-thin material processing, capacitor film slitting machine is widely used in the field of precision electronic film (such as MLCC dielectric film, lithium battery separator, flexible circuit substrate, etc.). The following is a professional analysis from three aspects: technical characteristics, application scenarios and industry trends:

First, analysis of technical advantages

1. Nanometer slitting accuracy

◦ The air bearing spindle (radial runout ≤1μm) and laser interferometer closed-loop control are used to achieve 0.5μm slitting accuracy, which meets the processing needs of ultra-thin polyimide (PI) film and PET film below 2μm.

◦ Active tension control system (fluctuation ±0.5N) with ultrasonic edge detection to avoid film stretching and deformation.

2. Multiphysics collaborative machining

◦ Integrated cold knife slitting (-30°C low temperature treatment) and laser micro edging technology to solve the problem of thermal deformation of polymer materials, and the cut roughness reaches Ra0.2μm.

3. Intelligent compensation system

◦ Machine vision-based in-line thickness monitoring (resolution 10nm) with adaptive tool wear compensation ensures consistent batch machining.

Second, typical application scenarios

Third, cutting-edge technology trends

1. Quantum dot film processing

For the CdSe quantum dot film for QLED display, an ultraviolet laser protection slitting process (wavelength 355nm, pulse width 15ps) was developed to avoid the photodegradation of quantum dot materials.

2. Ultra-thin copper foil treatment

The slitting of 6μm electrolytic copper foil uses a nano-diamond-coated tool (cutting edge radius 50nm) and hydrogen-helium mixed gas protection to achieve curl-free cutting.

3. Digital twin system

Predicting tool life with real-time digital mirroring (sampling frequency 1kHz) reduces unplanned downtime by up to 70%.

Fourth, industry challenges and development

• Bottleneck: Single-layer slitting of 2D materials such as graphene still has edge lattice damage (defect density> 10³/cm²)

• Innovation direction:

◦ Atomic layer etching (ALE) technology is a composite process of mechanical slitting

◦ Terahertz band on-line detection system (0.1-10THz)

With the explosion of emerging demand for 5G/6G high-frequency substrate materials and perovskite photovoltaic films, the next generation of slitting machines will develop in the direction of "atomic-level precision + AI real-time control", and the global market size is expected to exceed $2.8B (CAGR 11.3%) in 2026.